Personal Information

Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates

Paper Publications

【SCI通讯】Modeling and Investigation of Minimum Chip Thickness for Silicon Carbide during Quasi-intermittent Vibration Assisted Swing Cutting

Hits:

Journal:The International Journal of Advanced Manufacturing Technology

Indexed by:Journal paper

Volume:127

Translation or Not:no

Date of Publication:2023-04-05

Included Journals:SCI

Next One:【SCI通讯】Experimental and simulation study of ultrasonic elliptical vibration cutting SiCp/Al composites: chip formation and surface integrity study

Home

Scientific Research

Teaching Research

Awards and Honours

Enrollment Information

Student Information

My Album

Blog

Personal Information

Paper Publications

【SCI通讯】Modeling and Investigation of Minimum Chip Thickness for Silicon Carbide during Quasi-intermittent Vibration Assisted Swing Cutting